The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jan. 09, 2024
Qualcomm Incorporated, San Diego, CA (US);
Mahadevamurty Nemani, San Diego, CA (US);
Vadim Gektin, San Jose, CA (US);
Anubhav Mishra, Fremont, CA (US);
Pradeep Kanapathipillai, Campbell, CA (US);
Nitin Makhija, San Jose, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Performing thermal management based on temperature evolution models in processor devices is disclosed herein. In some aspects, a processor device provides a cluster thermal management circuit that is configured to determine power consumption measurements for corresponding functional units of a processor core of a plurality of processor cores of a core cluster. The cluster thermal management circuit also determines temperature measurements by corresponding digital thermal sensors (thermal sensor) external to a point of interest (POI) within the processor core. The cluster thermal management circuit generates a predicted temperature at the POI based on a temperature evolution model that correlates power consumption measurements and temperature measurements with the predicted temperature at the POI. If the cluster thermal management circuit determines the predicted temperature at the POI exceeds a thermal mitigation threshold, the cluster thermal management circuit performs a thermal management operation.