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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12668718 B1

PDFFull Text
Date of Patent:
Jun. 30, 2026

Filed:

Jun. 08, 2023

Composition for semiconductor processing and method of fabricating semiconductor device using the same

Applicant:

SK Enpulse Co., Ltd., Gyeonggi-do, KR;

Inventors:

Seung Chul Hong, Seoul, KR;

Deok Su Han, Seoul, KR;

Kang Sik Myung, Seoul, KR;

Han Teo Park, Seoul, KR;

Hyeong Ju Lee, Seoul, KR;

Yong Soo Choi, Seoul, KR;

Assignee:

YCCHEM CO., LTD., Gyeongsangbuk-do, KR;

Attorney:

IP & T GROUP LLP

Primary Examiner:

Alexandra M Moore

Int. Cl.
CPC ...
C09G 1/02 (2006.01); H10P 52/40 (2026.01); H10P 95/00 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H10P 52/403 (2026.01); H10P 95/062 (2026.01); H10W 20/023 (2026.01); H10W 20/062 (2026.01); H10W 20/092 (2026.01);
Abstract

This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion and a hydrophilic portion; in which the hydrophobic portion includes a Cto Chydrocarbon group and the hydrophilic portion comprises at least one group selected from the group consisting of a phosphate group and a phosphonate group. The polishing composition has a pH of about 2 to about 6.5.

Find Patent Forward Citations

Hong, Seung. (2026). Composition for semiconductor processing and method of fabricating semiconductor device using the same (U.S. Patent No. 12668718). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12668718

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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