The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Nov. 07, 2023
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Korea Electronics Technology Institute, Seongnam-si, KR;

Inventors:

Tae Young Choi, Gwacheon-si, KR;

Keum Hwan Park, Seongnam-si, KR;

Young Min Kim, Seongnam-si, KR;

Young Eun Kim, Hanam-si, KR;

Ji Young Kim, Seoul, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/66 (2006.01); C08G 59/68 (2006.01); C08J 5/18 (2006.01); C08K 3/30 (2006.01); C09K 11/02 (2006.01); C09K 11/61 (2006.01);
U.S. Cl.
CPC ...
C08G 59/226 (2013.01); C08G 59/245 (2013.01); C08G 59/66 (2013.01); C08G 59/686 (2013.01); C08J 5/18 (2013.01); C08K 3/30 (2013.01); C09K 11/02 (2013.01); C09K 11/612 (2013.01); C08J 2363/02 (2013.01); C08K 2003/3036 (2013.01);
Abstract

In embodiment, a binder composition includes a multifunctional compound containing three or more functional groups, a first bifunctional epoxy resin, and a second bifunctional epoxy resin. The second bifunctional epoxy resin can have a weight average molecular weight greater than a weight average molecular weight of the first bifunctional epoxy resin, and a mass ratio of the first bifunctional epoxy resin and the second bifunctional epoxy resin is in a range from 0.45:1 to 7.0:1. In an embodiment, an epoxy-based cured product includes such binder composition. And in an embodiment, a light emitting layer includes such epoxy-based cured product.


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