The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Oct. 26, 2022
Applicant:

Agc Inc., Tokyo, JP;

Inventors:

Mikio Nagano, Chiyoda-ku, JP;

Seiji Inaba, Chiyoda-ku, JP;

Rikiya Kado, Chiyoda-ku, JP;

Kiyoshi Tamai, Chiyoda-ku, JP;

Yuha Kobayashi, Chiyoda-ku, JP;

Assignee:

AGC Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 3/085 (2006.01); C03C 3/062 (2006.01); H01L 21/56 (2006.01); H10W 74/01 (2026.01);
U.S. Cl.
CPC ...
C03C 3/085 (2013.01); C03C 3/062 (2013.01); H10W 74/019 (2026.01);
Abstract

Glass contains, in mol percentage on an oxide basis, SiO: 35% to 60%, BO: 0.8% to 8%, AlO: 6% to 21%, and MgO: 17% to 44%. Additionally, (MgO/AlO)≥1 is satisfied, a measured Madelung constant m calculated by an expression (1A) is equal to or larger than 1.05, and a thermal expansion factor as a ratio of a measured value α of a linear thermal expansion coefficient to a calculated value αof a linear thermal expansion coefficient calculated from composition is equal to or smaller than 0.7. Herein, E is a measured value of a Young's modulus of the glass, Vis an average atomic packing factor of the glass, and Gis average bond dissociation energy of the glass.


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