The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Apr. 29, 2024
Applicant:

Wuhan Kornnac Technology Co., Ltd., Hubei, CN;

Inventors:

Jianhua Huang, Hubei, CN;

Xianghan Zhou, Hubei, CN;

Ye Chen, Hubei, CN;

Chaohuang Liu, Hubei, CN;

Fei Xiong, Hubei, CN;

Yong Zeng, Hubei, CN;

Zhiyong Zhang, Hubei, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B67C 3/02 (2006.01); A61J 3/07 (2006.01);
U.S. Cl.
CPC ...
B67C 3/02 (2013.01); A61J 3/07 (2013.01);
Abstract

A method and a system for filling and sealing a liquid-filled hard capsule are provided. The method includes: separating a capsule body and a capsule cap, filling a material into the capsule body, and inflating an inert gas into the capsule cap, wherein the material at least includes a liquid; fitting the capsule cap and the capsule body obtained in step Sto obtain a liquid-filled capsule; injecting a glue into a fitting gap, while applying pressure to the liquid-filled capsule, so that the glue fills the fitting gap using negative pressure, and then heating the fitting gap to implement sealing.


Find Patent Forward Citations

Huang, Jianhua. (2026). Method and system for filling and sealing liquid-filled hard capsule (U.S. Patent No. 12668476). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12668476

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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