The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Mar. 26, 2021
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Yasuda, Tokyo, JP;

Takanori Yamashita, Tokyo, JP;

Tetsuya Ojiri, Tokyo, JP;

Hiroyuki Kotera, Tokyo, JP;

Tsuyoshi Ito, Tokyo, JP;

Yoshiko Kiyohara, Tokyo, JP;

Kazufumi Kodani, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/129 (2021.01); B32B 7/12 (2006.01); B32B 15/088 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); H01G 11/80 (2013.01); H01G 11/84 (2013.01); H01M 50/105 (2021.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/124 (2021.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 15/088 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); H01G 11/80 (2013.01); H01G 11/84 (2013.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/1243 (2021.01); H01M 50/129 (2021.01); B32B 2250/04 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2270/00 (2013.01); B32B 2307/31 (2013.01); B32B 2307/54 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/7376 (2023.05); B32B 2457/10 (2013.01); B32B 2457/16 (2013.01);
Abstract

A power storage device is constituted by a laminate including, in the stated order, at least a substrate layer, a barrier layer, and an inside layer. The inside layer is provided with an adhesive layer and a heat-sealing resin layer from the barrier layer side; and if dynamic viscoelasticity is measured by tension with respect to the inside layer, the growth rate at 80° C. is 8.0% or lower.


Find Patent Forward Citations

Yasuda, Daisuke. (2026). Packaging material for power storage device, method of producing same, and power storage device (U.S. Patent No. 12668040). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12668040

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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