The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Jun. 16, 2023
Applicant:

Sumitomo Heavy Industries, Ltd., Tokyo, JP;

Inventor:

Kazuya Hioki, Yokosuka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 48/92 (2019.01); B29C 48/00 (2019.01); B29C 55/28 (2006.01);
U.S. Cl.
CPC ...
B29C 48/92 (2019.02); B29C 48/0018 (2019.02); B29C 55/28 (2013.01); B29C 2948/92209 (2019.02); B29C 2948/92447 (2019.02);
Abstract

An inflation molding device includes a viscosity estimation unit that estimates a viscosity of a bubble discharged in a substantially cylindrical shape from a die, a temperature identification unit that identifies a temperature of the bubble, and a parameter estimation unit that estimates a viscosity parameter of the bubble based on the viscosity of the bubble estimated by the viscosity estimation unit and the temperature of the bubble identified by the temperature identification unit.


Find Patent Forward Citations

Hioki, Kazuya. (2026). Inflation molding device (U.S. Patent No. 12668013). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12668013

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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