The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Mar. 28, 2024
Samsung Sdi Co., Ltd., Yongin-si, KR;
Kyungtaek Choi, Yongin-si, KR;
Young-Hak Pyo, Yongin-si, KR;
Jin Seo Park, Yongin-si, KR;
Wonsub Seo, Yongin-si, KR;
Gisung Kim, Yongin-si, KR;
Byoungkuk Kim, Yongin-si, KR;
Sohun Kim, Yongin-si, KR;
SAMSUNG SDI CO., LTD., Yongin-si, KR;
Abstract
A multi-slot die includes a plurality of dies that form a continuous coating portion along a length direction on one electrode substrate that continuously proceeds in multiple columns to be spaced apart from each other along a width direction intersecting the length direction, using a supplied active material slurry, a plurality of gap adjustment assemblies that are provided corresponding to each of the dies and independently adjust gaps set between each of the dies and the electrode substrate along a discharge direction of the die and a die position adjustment assembly that is provided corresponding to the gap adjustment assemblies and independently adjusts positions of the dies with respect to the width direction.