The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Sep. 09, 2022
Applicants:
Olympus Corporation, Hachioji, JP;
National Cancer Center, Tokyo, JP;
Inventors:
Arimasa Sugimoto, Hachioji, JP;
Satoru Nonaka, Tokyo, JP;
Assignees:
OLYMPUS CORPORATION, Tokyo, JP;
NATIONAL CANCER CENTER, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 17/00 (2006.01); A61B 17/04 (2006.01);
U.S. Cl.
CPC ...
A61B 17/00234 (2013.01); A61B 17/0469 (2013.01); A61B 2017/00296 (2013.01);
Abstract
A full-thickness resection method for a gastrointestinal tract includes forming a pair of first markings in surrounding tissue on both sides of a lesion to sandwich the lesion therebetween; performing a full-thickness resection to a portion including the lesion; identifying a pair of suture locations in the vicinity of the pair of first markings; and suturing the pair of first suture locations.
Quick Actions:
Sugimoto, Arimasa. (2026). Full-thickness resection method (U.S. Patent No. 12667349). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12667349
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile