The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Apr. 09, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hongki Kim, Suwon-si, KR;

Youngjin Oh, Suwon-si, KR;

Seungho Lee, Suwon-si, KR;

Jungsoo Kim, Suwon-si, KR;

Ikhyun Cho, Suwon-si, KR;

Chijeong Choi, Suwon-si, KR;

Seungnyun Kim, Suwon-si, KR;

Yongsang Yun, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 5/1455 (2006.01); G06F 1/16 (2006.01); H02J 50/10 (2016.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01R 12/51 (2011.01); H01R 13/6594 (2011.01);
U.S. Cl.
CPC ...
A61B 5/681 (2013.01); A61B 5/0059 (2013.01); A61B 5/1455 (2013.01); G06F 1/163 (2013.01); H02J 50/10 (2016.02); H05K 1/0218 (2013.01); H05K 1/111 (2013.01); A61B 2560/0214 (2013.01); A61B 2562/166 (2013.01); H01R 12/51 (2013.01); H01R 13/6594 (2013.01); H05K 1/0298 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/10151 (2013.01);
Abstract

Various embodiments relate to an electronic device including a biometric sensor and a wireless charging module. According to various embodiments, there may be provided a sensor module including: a circuit board; a biometric sensor disposed in a first area of a first surface of the circuit board; a conductive line disposed in a second area of the first surface of the circuit board and surrounding at least a portion of the biometric sensor when viewed from above the first surface of the circuit board; a plurality of electrode pads disposed in a third area of a second surface of the circuit board; and at least one electronic component comprising electronic circuitry disposed in the third area of the second surface of the circuit board and electrically connected to at least one of the plurality of electrode pads.


Find Patent Forward Citations

Loading…