The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Sep. 26, 2023
Apple Inc., Cupertino, CA (US);
Kyusang Kim, Singapore, SG;
David M Kindlon, Felton, CA (US);
Kishore N Renjan, Singapore, SG;
Manoj Vadeentavida, Singapore, SG;
Bilal Mohamed Ibrahim Kani, Singapore, SG;
Benjamin J Grena, San Francisco, CA (US);
Ali N Ergun, Sunnyvale, CA (US);
Jerzy S Guterman, Sunnyvale, CA (US);
Jee Tung Tan, Singapore, SG;
Steven Webster, Singapore, SG;
Parin R Dedhia, Sunnyvale, CA (US);
Howell John Chua Toc, Singapore, SG;
Mandar S Painaik, Chandler, AZ (US);
Abhay Maheshwari, Monte Sereno, CA (US);
Wyeman Chen, Newark, CA (US);
Yanfeng Chen, San Ramon, CA (US);
Andrew N Leopold, San Francisco, CA (US);
Jun Zhang, Cupertino, CA (US);
Dhruv Gaba, San Francisco, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.