The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
May. 31, 2023
Applicant:
Hue Inc., Shanghai, CN;
Inventor:
Yang Yue, Shanghai, CN;
Assignee:
Hue Inc., Shanghai, CN;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 72/90 (2026.01); H10K 50/842 (2023.01); H10K 59/80 (2023.01); H10W 72/50 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10K 50/8426 (2023.02); H10K 59/8722 (2023.02); H10W 72/5445 (2026.01); H10W 72/932 (2026.01); H10W 72/936 (2026.01); H10W 90/754 (2026.01);
Abstract
A micro package structure includes a micro LED panel including an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and a seal structure formed between an edge of the micro LED panel and an edge of the top cover plane around the micro LED array area.