The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Mar. 09, 2023
Mitsubishi Electric Corporation, Tokyo, JP;
Keisuke Kawamoto, Tokyo, JP;
Keisuke Eguchi, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An object is to provide a technique capable of improving productivity of a semiconductor device by reducing a wiring length of a wire. A semiconductor device includes a semiconductor element and a control IC controlling the semiconductor element, wherein the semiconductor element includes a pair of signal pad groups made up of a plurality of signal pads, the control IC includes a plurality of signal pads, the plurality of signal pads in the control IC are wire-bonding connected to the signal pad group closer to the plurality of signal pads in the control IC in the pair of signal pad groups in the semiconductor element.