The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Sep. 02, 2021
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Tan Nhat Hoang, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 25/07 (2006.01); H10W 70/20 (2026.01); H10W 70/65 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/658 (2026.01); H10W 70/20 (2026.01); H10W 74/131 (2026.01); H10W 90/00 (2026.01); H10W 90/701 (2026.01);
Abstract

A semiconductor device includes a first and a second semiconductor elements and a wiring board. The first semiconductor element has a first electrode, a second electrode and a third electrode, and current flow between the first electrode and the second electrode is on-off controlled. The second semiconductor element has a fourth electrode, a fifth electrode and a sixth electrode, and current flow between the fourth electrode and the fifth electrode is on-off controlled. The wiring board includes a base, an obverse surface wiring layer, a reverse surface wiring layer, and a metal member inserted in the base to electrically connect the obverse surface wiring layer and the reverse surface wiring layer. The first semiconductor element and the second semiconductor element are connected in series by connecting the second electrode and the fourth electrode. The metal member is in a conduction path between the second electrode and the fourth electrode.


Find Patent Forward Citations

Hoang, Tan. (2026). Semiconductor apparatus (U.S. Patent No. 12666987). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12666987

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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