The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Nov. 27, 2023
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Katsuya Sato, Yokohama, JP;
Tetsuya Yamamoto, Sagamihara, JP;
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;
Abstract
According to an embodiment, a semiconductor device includes a first electrode, a second electrode, a semiconductor chip, and a third electrode. The second electrode includes a plurality of terminals, and one slit. The one slit is formed between adjacent two out of the plurality of terminals. The semiconductor chip includes a first face and a second face. The first face is connected to the first electrode via a joining material. The second face is opposite the first face and connected to the second electrode via a joining material. The third electrode is connected to the second face via a joining material, inside the slit provided in the second electrode.