The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Aug. 08, 2023
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Susumu Yamamoto, Yokkaichi, JP;

Hideki Matsushige, Yokkaichi, JP;

Gen Toyota, Yokkaichi, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H10W 20/20 (2026.01); H10W 46/00 (2026.01); H10W 72/90 (2026.01); H10W 80/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 46/00 (2026.01); H10W 20/20 (2026.01); H10W 46/301 (2026.01); H10W 72/926 (2026.01); H10W 72/967 (2026.01); H10W 80/163 (2026.01); H10W 90/792 (2026.01);
Abstract

There is provided a semiconductor device including a first chip and a second chip bonded to the first chip. The first chip includes a first alignment mark provided in a first region of a bonding surface and a plurality of first dummy pads provided in a second region of the bonding surface different from the first region. The second chip includes a second alignment mark provided on the bonding surface corresponding to the first alignment mark and a plurality of second dummy pads provided in a region of the bonding surface different from the second alignment mark. A coverage of the first alignment mark in the first region is substantially the same as the coverage of the first dummy pads in the second region.


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