The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Oct. 13, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Tetsunari Saito, Tokyo, JP;
Seiichi Tsuji, Tokyo, JP;
Hiroaki Minamide, Tokyo, JP;
Ko Kanaya, Tokyo, JP;
Shunichi Abe, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An input feedthrough () and an output feedthrough () provided on the substrate () are wire-connected to an input pad () and an output pad () of the semiconductor chip () respectively. A metal seal ring () is provided on the substrate () is electrically connected to the metal plate () by a through-hole (). A conductive cap () is bonded to the metal seal ring () and covers a place above the semiconductor chip (). Both ends of an isolation metal wire () are electrically connected to the metal plate () and a loop comes into contact with a lower surface of the conductive cap (). The isolation metal wire () constitutes an isolation wall partitioning an inner space into a region including the input feedthrough () and a region including the output feedthrough ().