The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Jul. 17, 2023
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Hiroyuki Nakamura, Tokyo, JP;
Shiori Uota, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/77 (2026.01); H10W 70/40 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 40/778 (2026.01); H10W 74/111 (2026.01);
Abstract
A power module includes a conductive die bonding portion, a semiconductor element bonded to an upper surface of the die bonding portion, a sealing member sealing the die bonding portion and the semiconductor element, and a flexible insulating member bonded to a lower surface of the die bonding portion. The flexible insulating member is arranged in a recessed portion on a lower surface of the sealing member and has a convex portion protruding from the lower surface of the sealing member.