The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Jul. 24, 2023
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Tae Hee Lee, Yongin-si, KR;

Min Woo Kim, Yongin-si, KR;

Sung Kook Park, Yongin-si, KR;

Jae Gwang Um, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H10H 29/14 (2025.01); H10P 72/70 (2026.01);
U.S. Cl.
CPC ...
H10P 72/74 (2026.01); H10H 29/142 (2025.01); H10P 72/7428 (2026.01); H10P 72/7432 (2026.01); H10P 72/744 (2026.01);
Abstract

An apparatus for fabricating a display panel and a fabricating method of a display panel are provided. An apparatus for fabricating a display panel includes a loading module of a large-area fabricating substrate fabricated and separated into a plurality of display panels, a solvent application module configured to apply a metal bonding solvent onto the large-area fabricating substrate, and an element transfer module configured to transfer a plurality of light emitting elements or at least one integrated circuit onto the large-area fabricating substrate on which the metal bonding solvent is applied, and the loading module includes a groove type discharge path through which the metal bonding solvent applied by the solvent application module flows and is discharged.


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