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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12666921 B1

PDFFull Text
Date of Patent:
Jun. 23, 2026

Filed:

Jun. 09, 2023

Processing apparatus using laser, method of laser lift-off and method of manufacturing semiconductor device

Applicant:

Kioxia Corporation, Minato-ku, JP;

Inventors:

Takuro Okubo, Yokkaichi, JP;

Hidekazu Hayashi, Yokkaichi, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:

Holtz, Holtz & Volek PC

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/68 (2006.01); B23K 26/073 (2006.01); B23K 26/08 (2014.01); B23K 26/18 (2006.01); H10P 72/70 (2026.01); B23K 101/40 (2006.01); H10B 80/00 (2023.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/74 (2026.01); B23K 26/0734 (2013.01); B23K 26/0823 (2013.01); B23K 26/0869 (2013.01); B23K 26/18 (2013.01); B23K 2101/40 (2018.08); H10B 80/00 (2023.02); H10P 72/7442 (2026.01); H10W 90/00 (2026.01); H10W 90/792 (2026.01);
Abstract

A processing apparatus using laser according to an embodiment includes a stage configured to hold a substrate and rotate, and a laser irradiation apparatus capable of moving in a radial direction of the rotation. The laser irradiation apparatus includes a control unit configured to control an output of an infrared pulsed laser so that L1/L2 satisfies 1.2 or more and 10 or less when a distance between laser spots adjacent to each other in a rotation direction of the stage is L1 and a distance between laser spots adjacent to each other in the radial direction of the rotation is L2.

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Okubo, Takuro. (2026). Processing apparatus using laser, method of laser lift-off and method of manufacturing semiconductor device (U.S. Patent No. 12666921). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12666921

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