The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Jul. 19, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sanghoon Kim, Suwon-si, KR;

Seongho Oh, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/809 (2025.01); H10F 39/811 (2025.01);
Abstract

The inventive concept provides an image sensor including a step having a slope shape and an image sensor including the wafer-to-wafer bonding structure. The image sensor includes a first substrate including a pixel array, a first multilayer wiring, a first insulation layer formed on a first junction surface to pass through the first insulation layer and a second substrate on the first substrate, wherein the second substrate includes a logic circuit, a second multilayer wiring, a second insulation layer on a second junction surface opposite to the first junction surface and a second metal pad passing through the second insulation layer, and a second step formed in the second junction surface engages with a first step formed in the first junction surface in a symmetrical slope shape to form direct bonding between the first substrate and the second substrate.


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Kim, Sanghoon. (2026). Wafer-to-wafer bonding structure and image sensor including the same (U.S. Patent No. 12666742). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12666742

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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