The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Apr. 14, 2023
Applicant:

E Ink Holdings Inc., Hsinchu, TW;

Inventors:

Ting-Yu Hsu, Hsinchu, TW;

Wei-Tsung Chen, Hsinchu, TW;

Assignee:

E Ink Holdings Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/01 (2026.01); H10D 86/40 (2025.01);
U.S. Cl.
CPC ...
H10D 86/0231 (2025.01); H10D 86/481 (2025.01);
Abstract

A TFT array substrate includes a bottom plate, a first metal layer, an insulating layer, a semiconductor layer, a second metal layer, and a transparent electrode layer. The first metal layer is located on the bottom plate. The insulating layer covers the bottom plate and the first metal layer. The semiconductor layer is located on the insulating layer and overlaps a first portion of the first metal layer. The second metal layer has a first portion on the semiconductor layer and a second portion on the insulating layer, and the second portion of the second metal layer overlaps a second portion of the first metal layer. A first portion of the transparent electrode layer is disposed along the first portion of the second metal layer, and a second portion of the transparent electrode layer is disposed along the second portion of the second metal layer.


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