The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Sep. 27, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jinhwan Jeon, Suwon-si, KR;

Kwangho Jung, Suwon-si, KR;

Chihyun Cho, Suwon-si, KR;

Sangwon Ha, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2025.01); H05K 1/11 (2006.01); H05K 1/181 (2026.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/341 (2026.01);
U.S. Cl.
CPC ...
H05K 5/0069 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/0044 (2013.01); H05K 3/284 (2013.01); H05K 3/341 (2013.01); H05K 5/0086 (2013.01); H05K 2201/09372 (2013.01); H05K 2201/10007 (2013.01);
Abstract

An electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. In the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.


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