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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12665367 B1

PDFFull Text
Date of Patent:
Jun. 23, 2026

Filed:

Nov. 08, 2022

Method of manufacturing electronic component and electronic component

Applicant:

Japan Aviation Electronics Industry, Limited, Tokyo, JP;

Inventors:

Youhei Kimita, Tokyo, JP;

Hiroshi Akimoto;

Takayuki Nishimura, Tokyo, JP;

Kazuya Sakamoto, Tokyo, JP;

Toru Nakatani, Tokyo, JP;

Assignee:

JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED, Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Thanh Tam T Le

Int. Cl.
CPC ...
H01R 43/24 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
H01R 43/24 (2013.01); H01R 43/02 (2013.01); H01R 2201/26 (2013.01);
Abstract

Each terminal includes a tapered portion having a tapered width and an extension portion extending from a narrow-side distal end of the tapered portion. A method includes, after positioning the extension portion in one of grooves formed in one surface of each sliding die, sliding the sliding dies relative to the extension portion to make tip edges of opposite side surfaces of the groove facing the cavity abut against opposite side surfaces of the tapered portion; and performing molding while keeping the upper die in close contact with the one surface, and keeping part of the tapered portion and the extension portion lying in the groove held between a bottom surface of the groove and the upper die with a remaining portion of the tapered portion lying in the cavity, thus forming a connection portion protruding from the housing with the part of the tapered portion and the extension portion.

Find Patent Forward Citations

Kimita, Youhei. (2026). Method of manufacturing electronic component and electronic component (U.S. Patent No. 12665367). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12665367

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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