The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Oct. 14, 2020
Applicant:

Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;

Inventors:

Wolfgang Heibler, Ostermünchen, DE;

Andreas Scheyer, Tuntenhausen, DE;

Wolfgang Heyde, Tuntenhausen, DE;

Matthias Riedel, Kiefersfelden, DE;

Maximilian Schlosser, Stephanskirchen, DE;

Thomas Kapfinger, Ebbs, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); H01R 9/05 (2006.01); H01R 12/53 (2011.01); H01R 24/50 (2011.01); H05K 3/341 (2026.01);
U.S. Cl.
CPC ...
H01R 4/023 (2013.01); H01R 9/0515 (2013.01); H01R 12/53 (2013.01); H01R 24/50 (2013.01); H05K 3/3421 (2013.01);
Abstract

A solder connection between a coaxial cable and a printed circuit board arrangement. The coaxial cable comprises an inner conductor, an outer conductor and a dielectric arranged in between. The printed circuit board arrangement comprises an outer conductor contact area and an inner conductor contact area. The outer conductor contact area comprises an outer conductor receiving opening. The coaxial cable runs at an angle to the printed circuit board arrangement, wherein a part of the outer conductor is arranged in the outer conductor receiving opening and wherein the inner conductor is arranged at the inner conductor contact area. A first solder joint connects the outer conductor to the outer conductor contact area. A second solder joint connects the inner conductor to the inner conductor contact area.


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