The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Jan. 05, 2023
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Kosuke Onishi, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/12 (2013.01); H01G 4/228 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01);
Abstract
A ceramic electronic component with a carrier substrate includes a ceramic electronic component including first and second principal surfaces, first and second end surfaces, first and second side surfaces, and at least two external electrodes on an outer surface of the ceramic electronic component, and a carrier substrate attached to the second principal surface of the ceramic electronic component, wherein a first adhesive layer is on the first principal surface of the ceramic electronic component.