The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

May. 02, 2023
Applicant:

Semes Co., Ltd., Cheonan-si, KR;

Inventors:

Moon Hyung Bae, Daegu, KR;

Hye Bin Baek, Incheon, KR;

Youngseo An, Osan-si, KR;

Euntark Lee, Cheonan-si, KR;

Min Jung Park, Daegu, KR;

Seunghan Lee, Cheonan-si, KR;

Jung-Hyun Lee, Cheonan-si, KR;

Assignee:

Semes Co., Ltd., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/16 (2006.01); H10P 14/00 (2026.01); H10P 72/00 (2026.01); H10P 72/76 (2026.01); H10P 14/60 (2026.01); H10P 72/30 (2026.01); H10P 72/70 (2026.01);
U.S. Cl.
CPC ...
G03F 7/167 (2013.01); H10P 14/00 (2026.01); H10P 72/0402 (2026.01); H10P 72/0432 (2026.01); H10P 72/7612 (2026.01); H10P 14/6512 (2026.01); H10P 72/0424 (2026.01); H10P 72/0448 (2026.01); H10P 72/0606 (2026.01); H10P 72/3302 (2026.01); H10P 72/3402 (2026.01); H10P 72/70 (2026.01); H10P 72/7602 (2026.01);
Abstract

The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.


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