The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

May. 31, 2022
Applicant:

Hanon Systems, Daejeon, KR;

Inventors:

Sangyong Rhee, Daejeon, KR;

In-Guk Hwang, Daejeon, KR;

Dong Suk Lee, Daejeon, KR;

Hae-Jun Lee, Daejeon, KR;

Sang Ok Lee, Daejeon, KR;

Assignee:

HANON SYSTEMS, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 1/053 (2006.01); B60H 1/00 (2006.01); B60H 1/32 (2006.01); B60K 11/02 (2006.01); F01P 11/04 (2006.01);
U.S. Cl.
CPC ...
F28D 1/05391 (2013.01); B60H 1/00921 (2013.01); B60H 1/3227 (2013.01); B60K 11/02 (2013.01); F01P 11/04 (2013.01); B60H 1/00571 (2013.01); B60H 2001/00928 (2013.01);
Abstract

An integrated cooling module includes a plate-shaped manifold and multiple cooling components mounted thereon. The manifold includes stacked first and second plates that form a first refrigerant channel recessed along a line structure of the first plate, while the second plate provides a flat sealing surface. A third plate can be further stacked to form a second refrigerant channel, and through-holes in the second plate allow communication between channels. Ports formed in the plates enable direct connection with external components. A condenser, chiller, expansion valve, pressure/temperature sensor, and an accumulator may be mounted on the manifold, which is arranged perpendicular to a bottom surface.


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