The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Apr. 12, 2022
Applicant:

Dupont Safety & Construction, Inc., Wilmington, DE (US);

Inventors:

Yuhei Nishimori, Kochi, JP;

Masahiko Ueta, Kochi, JP;

Assignee:

DUPONT SAFETY & CONSTRUCTION, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); D21H 13/26 (2006.01); D21H 15/02 (2006.01); D21H 21/00 (2006.01);
U.S. Cl.
CPC ...
D21H 15/02 (2013.01); D21H 13/26 (2013.01); D21H 21/00 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0284 (2013.01); H05K 2201/0293 (2013.01);
Abstract

A circuit board nonwoven fabric comprising a paper-formed structure which comprises a plurality of thick fibers in which the portion of greatest fiber diameter is 5 μm or greater, and a plurality of fine fibers in which the portion of greatest fiber diameter is less than 5 μm, wherein an average fiber length of the thick fibers is greater than an average fiber length of the fine fibers, the number of fine fibers is greater than the number of thick fibers, and the thick fibers have a flat shape with a major axis and a minor axis, the minor axis being oriented in a thickness direction of the paper-formed structure.


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