The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Dec. 26, 2023
Applicant:
Amulaire Thermal Technology, Inc., New Taipei City, TW;
Inventors:
Yi-Hsin Huang, New Taipei City, TW;
Ching-Ming Yang, New Taipei City, TW;
Kuo-Wei Lee, New Taipei City, TW;
Tze-Yang Yeh, New Taipei City, TW;
Assignee:
AMULAIRE THERMAL TECHNOLOGY, INC., New Taipei City, TW;
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); C23C 14/16 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); C22C 21/02 (2006.01); C22C 21/08 (2006.01);
U.S. Cl.
CPC ...
C23C 28/021 (2013.01); B32B 15/016 (2013.01); B32B 15/017 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C23C 14/16 (2013.01); C23C 14/165 (2013.01); C23C 28/023 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C22C 21/02 (2013.01); C22C 21/08 (2013.01); Y10T 428/12736 (2015.01); Y10T 428/12764 (2015.01); Y10T 428/12792 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/26 (2015.01); Y10T 428/265 (2015.01);
Abstract
A surface-modified aluminum alloy substrate structure includes a 6000-Series aluminum alloy substrate, a diffusion buffer layer, and a meltable metallic layer. The diffusion buffer layer is formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer. The meltable metallic layer is formed on the diffusion buffer layer for being melted in a subsequent process.