The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Sep. 15, 2021
Applicant:

Hamamatsu Photonics K.k., Hamamatsu, JP;

Inventors:

Tomoyuki Ide, Hamamatsu, JP;

Daiki Suzuki, Hamamatsu, JP;

Mikito Takahashi, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81C 99/00 (2010.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00666 (2013.01); B81C 1/00888 (2013.01); B81C 99/004 (2013.01); G02B 26/0833 (2013.01);
Abstract

A method for manufacturing a mirror device is a method for manufacturing a mirror device including a structural body that includes a support portion, a movable portion, and a coupling portion, and a mirror layer provided on the movable portion. The method for manufacturing a mirror device includes: a first forming step of forming a plurality of parts on a wafer, each of the plurality of parts corresponding to the structural body; a second forming step of forming the mirror layer on a part of each of the plurality of parts, the part corresponding to the movable portion; a heating step of heating the part of each of the plurality of parts, corresponding to the movable portion, after the first forming step and the second forming step; and a cutting step of cutting the wafer to separate the plurality of parts from one another, after the heating step.


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