The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Oct. 31, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Atsunori Terasaki, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B41J 2/1609 (2013.01); B41J 2/14209 (2013.01); B41J 2202/03 (2013.01); B41J 2202/22 (2013.01);
Abstract

An object is to provide a laminated substrate, a liquid ejection head, and a method of manufacturing a laminated substrate which are capable of preventing a decrease in the yield of a manufacturing process due to the substrate getting broken and an organic resin material sticking out. To that end, a structure including an eave portion having an overhang with a predetermined length is provided on a predetermined surface of a first substrate so as to form a space between the structure and the predetermined surface, and a resin is filled in the space.


Find Patent Forward Citations

Terasaki, Atsunori. (2026). Laminated substrate, liquid ejection head, and method of manufacturing laminated substrate (U.S. Patent No. 12661893). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12661893

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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