The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Dec. 27, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Tatsurou Mori, Tokyo, JP;

Shuzo Iwanaga, Kanagawa, JP;

Hiromasa Amma, Kanagawa, JP;

Shingo Okushima, Kanagawa, JP;

Satoshi Kimura, Kanagawa, JP;

Koichi Ishida, Tokyo, JP;

Tomohiro Takahashi, Kanagawa, JP;

Hiroaki Mihara, Tokyo, JP;

Yuhei Oikawa, Tokyo, JP;

Takatoshi Nakano, Kanagawa, JP;

Yoshihiro Hamada, Kanagawa, JP;

Fumi Tanaka, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/155 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/175 (2006.01); B41J 2/18 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14024 (2013.01); B41J 2/14032 (2013.01); B41J 2/155 (2013.01); B41J 2/1601 (2013.01); B41J 2/1623 (2013.01); B41J 2/17596 (2013.01); B41J 2/18 (2013.01); B41J 2002/14411 (2013.01);
Abstract

A liquid ejection head includes a printing element substrate including an ejection surface provided with a first ejection orifice array in which ejection orifices configured to be capable of ejecting a liquid are arranged in plurality in an array direction and a second ejection orifice array arranged in a direction intersecting with the array direction and the first ejection orifice array; and a protective member provided with a first opening corresponding to the first ejection orifice array and a second opening corresponding to the second ejection orifice array. The protective member is arranged adjacent to the ejection surface of the printing element substrate via an adhesive arranged between the first ejection orifice array and the second ejection orifice array.


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