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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12661837 B1

PDFFull Text
Date of Patent:
Jun. 23, 2026

Filed:

Oct. 05, 2023

Injection molding method and injection molding machine

Applicant:

Nissei Plastic Industrial Co., Ltd., Nagano-ken, JP;

Inventors:

Hirofumi Murata, Hanishina-gun, JP;

Toshimi Kato, Hanishina-gun, JP;

Hozumi Yoda, Hanishina-gun, JP;

Assignee:

NISSEI PLASTIC INDUSTRIAL CO., LTD., Nagano-Ken, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Thu Khanh T Nguyen

Int. Cl.
CPC ...
B29C 45/56 (2006.01); B29C 45/17 (2006.01); B29C 45/26 (2006.01); B29C 45/66 (2006.01); B29C 45/76 (2006.01); B29K 101/10 (2006.01);
U.S. Cl.
CPC ...
B29C 45/561 (2013.01); B29C 45/1774 (2013.01); B29C 45/2602 (2013.01); B29C 45/66 (2013.01); B29C 2045/565 (2013.01); B29C 45/7653 (2013.01); B29C 2945/76505 (2013.01); B29C 2945/76709 (2013.01); B29K 2101/10 (2013.01);
Abstract

Mold clamping conditions, including a predetermined mold gap, a predetermined mold clamping force, a predetermined back pressure for a movable mold, a predetermined mold closing pressure, and a predetermined mold closing pressure adjustment condition associated with the compression state of a molding material, are set beforehand. At the time of molding, an injection filling process for causing the injection device to inject and fill the molding material into a mold of a mold clamping device for which the mold clamping conditions have been set is performed, and, after completion of the injection filling process, a compression process is performed on the basis of the mold clamping conditions including the mold closing pressure adjustment condition.

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Murata, Hirofumi. (2026). Injection molding method and injection molding machine (U.S. Patent No. 12661837). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12661837

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