The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Mar. 29, 2023
Applicant:

Amag Rolling Gmbh, Braunau am Inn—Ranshofen, AT;

Inventors:

Petra Morak, Ranshofen, AT;

Gerhard Hanko, Simbach am Inn, DE;

Assignee:

AMAG ROLLING GMBH, Braunau am Inn—Ranshofen, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B21B 3/00 (2006.01); B23K 35/28 (2006.01); B23K 35/365 (2006.01); C22C 21/02 (2006.01); C23G 1/22 (2006.01);
U.S. Cl.
CPC ...
B23K 35/365 (2013.01); B21B 3/00 (2013.01); B23K 35/288 (2013.01); B32B 15/016 (2013.01); C22C 21/02 (2013.01); C23G 1/22 (2013.01);
Abstract

A composite material and method for producing said composite material are disclosed, with a support layer composed of a wrought aluminum alloy and with an external solder layer composed of an aluminum solder alloy provided on one or both flat sides of the support layer, wherein the solder layer has partially exposed silicon particles on its surface, which constitute a first area fraction of the total area of the surface of the solder layer. In order to reliably ensure flux-free solderability, it is proposed for the solder layer to have a rolled surface and for its aluminum solder alloy to contain at least 0.1 wt % bismuth (Bi), wherein the first area fraction is greater than 2.5%.


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