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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12661724 B1

PDFFull Text
Date of Patent:
Jun. 23, 2026

Filed:

Nov. 07, 2023

On-machine three-dimensional profiling machining device and method for complex configuration composite

Applicants:

Chongqing University of Technology, Chongqing, CN;

Aerospace Research Institute of Materials & Processing Technology, Beijing, CN;

Beijing Institute of Astronautical Systems Engineering, Beijing, CN;

Inventors:

Da Qu, Chongqing, CN;

Yuan Gao, Beijing, CN;

Ziran Chen, Chongqing, CN;

Xiaojing MA, Beijing, CN;

Yibo Zhao, Beijing, CN;

Wei Zheng, Beijing, CN;

Xingqi Tang, Chongqing, CN;

Qiwei Wu, Chongqing, CN;

Xiaoqiang Xu, Chongqing, CN;

Assignees:

CHONGQING UNIVERSITY OF TECHNOLOGY, Chongqing, CN;

AEROSPACE RESEARCH INSTITUTE OF MATERIALS & PROCESSING TECHNOLOGY, Beijing, CN;

BEIJING INSTITUTE OF ASTRONAUTICAL SYSTEMS ENGINEERING, Beijing, CN;

Attorney:
Primary Examiner:

Erica E Cadugan

Int. Cl.
CPC ...
B23C 1/12 (2006.01); B23C 3/00 (2006.01); B23Q 1/00 (2006.01); B23Q 1/01 (2006.01); B23Q 1/54 (2006.01); B23Q 15/02 (2006.01); B23Q 15/04 (2006.01); B23Q 15/06 (2006.01); B23Q 15/12 (2006.01); B23Q 15/14 (2006.01); B23Q 15/26 (2006.01); B23Q 17/20 (2006.01); B23Q 17/22 (2006.01); B23Q 17/24 (2006.01); B23B 5/08 (2006.01); B23B 5/16 (2006.01); B23B 25/06 (2006.01); B23G 1/22 (2006.01);
U.S. Cl.
CPC ...
B23C 3/007 (2013.01); B23C 1/12 (2013.01); B23Q 1/0009 (2013.01); B23Q 1/5462 (2013.01); B23Q 15/02 (2013.01); B23Q 15/04 (2013.01); B23Q 15/06 (2013.01); B23Q 15/12 (2013.01); B23Q 15/26 (2013.01); B23Q 17/2233 (2013.01); B23Q 17/2428 (2013.01); B23Q 17/248 (2013.01); B23B 5/08 (2013.01); B23B 5/16 (2013.01); B23B 25/06 (2013.01); B23B 2215/72 (2013.01); B23B 2260/128 (2013.01); B23B 2270/48 (2013.01); B23C 2260/76 (2013.01); B23G 1/225 (2013.01); B23Q 17/225 (2013.01); Y10T 82/22 (2015.01); Y10T 409/307336 (2015.01); Y10T 409/30756 (2015.01); Y10T 409/308512 (2015.01); Y10T 409/309576 (2015.01);
Abstract

The invention belongs to the technical field of aerospace product machinery manufacturing. Disclosed are on-machine three-dimensional profiling machining device for complex-configured composite material pipelines and an application method thereof. The on-machine three-dimensional profiling of the complex-configured composite material pipelines is In the shape machining device, a precision lifting rod is installed on the linear motion module, and a depth vision system is installed on the precision lifting rod; a precision linear motion table and a radial motion module are installed at the left end of the on-machine measurement hollow machining structure, laser displacement sensor probe, and the eddy current sensor probe is installed on the left end of the hollow machining structure for on-machine measurement through mounting bolts. The invention has the advantages of high integration, simple operation, convenience and practicality.

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