The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Aug. 30, 2023
Applicant:

Shifamed Holdings, Llc, Campbell, CA (US);

Inventors:

Peter Andriola, Castro Valley, CA (US);

Brian Fahey, Menlo Park, CA (US);

Shahn Sage, Clear Lake, MN (US);

Eric N. Rudie, Maple Grove, MN (US);

Assignee:

Shifamed Holdings, LLC, Campbell, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61M 27/00 (2006.01); H01Q 1/27 (2006.01); H01Q 1/36 (2006.01);
U.S. Cl.
CPC ...
A61M 27/002 (2013.01); H01Q 1/273 (2013.01); H01Q 1/362 (2013.01); A61M 2205/0266 (2013.01); A61M 2205/04 (2013.01); A61M 2205/3303 (2013.01); A61M 2205/3327 (2013.01); A61M 2205/3523 (2013.01); A61M 2205/3592 (2013.01); A61M 2205/50 (2013.01); A61M 2205/8206 (2013.01); A61M 2205/8243 (2013.01); A61M 2210/125 (2013.01);
Abstract

The present technology is directed to implantable medical systems that can include a first implantable device, a second implantable device, and a communication assembly that extends between and physically couples the first device and the second device. The first device can include one or more first electronic components, and the second device can include one or more second electronic components. The communication assembly can include (a) one or more first wires that are configured to wirelessly receive data from, and/or wirelessly transmit data to, a third device positioned external to the patient, and (b) one or more second wires that are configured to conductively transfer power between the first electronic components and the second electronic components. In some embodiments, the one or more first wires have a helical configuration, and the one or more second wires have a linear configuration and extend within the one or more first wires.


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