The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Dec. 06, 2021
Applicants:

Asahi Intecc Co., Ltd., Seto, JP;

Pathways Medical Corporation, Santa Clara, CA (US);

Inventors:

Nitin Patil, Danville, CA (US);

Minoru Ogawa, Seto, JP;

Philip R. Houle, Sunnyvale, CA (US);

Assignees:

ASAHI INTECC CO., LTD., Seto, JP;

PATHWAYS MEDICAL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61M 25/09 (2006.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
A61M 25/09 (2013.01); A61M 2025/09075 (2013.01); A61M 2025/09108 (2013.01); A61M 2205/0233 (2013.01); H01R 2107/00 (2013.01);
Abstract

Multiple approaches to incorporating multiple conductors on a guidewire by building the multiple conductor traces of variable sizes and material compositions on separate insulating layers are described. The approaches described in the invention facilitate ease of assembly of sensors to the guidewire or catheter element. This approach is particularly useful in scenarios where electrical or mechanical properties of the device need to be altered in specific sections to either enhance device performance and reliability (e.g. selective abrasion resistance), or facilitate ease of assembly (e.g. soldering or connection ease), or in some instances achieve desired electrical characteristics (e.g. impedance). The desired properties are incorporated into the same device requiring an innovative approach to forming signal wires in an otherwise tight space without impacting the primary mechanical performance of the devices.


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