The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Nov. 17, 2022
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
A module includes an assembly of a semiconductor device die, a lead frame connected to the semiconductor device die, and a substrate connected to the lead frame. The substrate includes at least one plated-through hole (PTH). A mold body encapsulates the assembly. The mold body includes a through-mold via (TMV) aligned with a portion of the substrate including the at least one PTH. The PTH is exposed in the TMV to an environment outside the mold body and is physically accessible from outside the mold body through the TMV.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile