The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Sep. 16, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kiho Kong, Suwon-si, KR;

Junghun Park, Yongin-si, KR;

Eunsung Lee, Seoul, KR;

Junhee Choi, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 20/01 (2025.01); H10H 20/831 (2025.01); H10H 20/851 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 20/01 (2025.01); H10H 20/8312 (2025.01); H10H 20/8514 (2025.01); H10H 20/857 (2025.01); H10H 20/032 (2025.01); H10H 20/0361 (2025.01); H10H 20/0364 (2025.01);
Abstract

A micro light-emitting device display apparatus and a method of manufacturing the same are provided. The micro light-emitting device display apparatus includes a display unit including an array of a plurality of micro light-emitting devices, a driving unit backplane, and a bonding structure formed on coupling surfaces, facing each other, of the display unit and the driving unit backplane, and electrically connecting the display unit to the driving unit backplane. The bonding structure includes a plurality of bonding pads on one of the coupling surfaces of the display unit and driving unit backplane, and a dot pad array formed on the other coupling surface in a two-dimensional array to cover the plurality of bonding pads and an area therebetween.


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