The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Mar. 30, 2021
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Michael Mantor, Orlando, FL (US);
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Abstract
A multi-die parallel processor semiconductor package includes a first base IC die including a first plurality of virtual compute dies 3D stacked on top of the first base IC die. A first subset of a parallel processing pipeline logic is positioned at the first plurality of virtual compute dies. Additionally, a second subset of the parallel processing pipeline logic is positioned at the first base IC die. The multi-die parallel processor semiconductor package also includes a second base IC die including a second plurality of virtual compute dies 3D stacked on top of the second base IC die. An active bridge chip communicably couples a first interconnect structure of the first base IC die to a first interconnect structure of the second base IC die.