The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Feb. 07, 2022
Applicant:

Schott Ag, Mainz, DE;

Inventors:

Thomas Zetterer, Landshut, DE;

Robert Hettler, Kumhausen, DE;

Antti Määttänen, Tampere, FI;

Jens Ulrich Thomas, Mainz, DE;

Yutaka Onezawa, Otsu, JP;

Frank Gindele, Schweitenkirchen, DE;

Assignee:

SCHOTT AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/10 (2026.01); B23K 26/20 (2014.01); B23K 26/24 (2014.01); H10W 40/25 (2026.01); B23K 101/36 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H10W 74/127 (2026.01); B23K 26/206 (2013.01); B23K 26/24 (2013.01); H10W 40/258 (2026.01); H10W 40/259 (2026.01); B23K 2101/36 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08);
Abstract

A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.


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