The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Feb. 14, 2023
Mediatek Inc., Hsin-Chu, TW;
Chung-Hsin Chiang, Hsinchu, TW;
MEDIATEK INC., Hsinchu City, TW;
Abstract
An antenna package includes a redistribution layer (RDL) structure having a top surface and a bottom surface opposite to the top surface and a TSV die disposed on the top surface of the RDL structure and encapsulated by a molding compound. The TSV die includes an active side and a rear side, and a sidewall of the TSV die is covered with the molding compound. The TSV die includes a plurality of through-silicon-vias including RF signal vias and ground vias penetrating through an entire thickness of the TSV die. An antenna structure is disposed on the rear side of the TSV die and is connected to the RF signal vias and ground vias.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile