The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Mar. 28, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventor:
Sang-Min Lee, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/685 (2026.01); H10W 70/05 (2026.01); H10W 70/69 (2026.01); H10W 72/20 (2026.01); H10W 72/30 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/685 (2026.01); H10W 70/05 (2026.01); H10W 70/69 (2026.01); H10W 72/252 (2026.01); H10W 72/387 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
A circuit board according to an embodiment includes: a first insulating layer that does not include a reinforcing material; a conductive pad that protrudes above a surface of the first insulating layer; a dam that protrudes from the surface of the first insulating layer and is disposed outside a region where the conductive pad is disposed on a plane; and a second insulating layer that is disposed below the first insulating layer and includes a reinforcing material. A height of the dam based on the surface of the first insulating layer is higher than a height of the conductive pad.