The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Apr. 26, 2023
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Assignee:
Renesas Electronics Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/495 (2006.01); H10W 70/40 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/481 (2026.01); H10W 70/417 (2026.01); H10W 74/01 (2026.01); H10W 74/114 (2026.01); H10W 72/07631 (2026.01); H10W 72/5525 (2026.01); H10W 72/871 (2026.01); H10W 72/886 (2026.01); H10W 90/736 (2026.01); H10W 90/755 (2026.01); H10W 90/767 (2026.01);
Abstract
A source pad electrically coupled with a source of a MOSFET of a semiconductor chip and located at a position below a lead in cross-sectional view is electrically connected with the lead for source via a conductive member bonded to the source pad and a wire bonded to the conductive member.