The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jun. 13, 2022
Texas Instruments Incorporated, Dallas, TX (US);
Yiqi Tang, Allen, TX (US);
Rajen Manicon Murugan, Dallas, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A routable lead frame (RLF) substrate has a conductive layer having first- and second-side traces having first fingers and second fingers, respectively, which are interdigitated with each other. A via layer is over the conductive layer. A first-side conductive via of the via layer is conductively coupled to the first-side trace. A second-side conductive via of the via layer is conductively coupled to the second-side trace. Dielectric molding material is disposed between the interdigitated fingers of the conductive layer and between the first-side conductive via and the second-side conductive via. The fingers and vias form an interdigital capacitor (IDC) useful in impedance matching and filtering.