The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Nov. 15, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Seunghyun Cho, Suwon-si, KR;
Jae-Min Jung, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/25 (2026.01); H10W 70/60 (2026.01); H10W 70/67 (2026.01); H10W 70/685 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/251 (2026.01); H10W 70/611 (2026.01); H10W 70/685 (2026.01); H10W 70/688 (2026.01); H10W 90/00 (2026.01); H10W 72/248 (2026.01); H10W 72/856 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
A semiconductor package includes a flexible insulating substrate including a first surface and a second surface opposite to the first surface, a first wiring on the first surface of the flexible insulating substrate, a second wiring on the second surface of the flexible insulating substrate, a plurality of vias coupling the first wiring to the second wiring, a plurality of semiconductor devices on the first surface of the flexible insulating substrate, and a heat dissipation resin layer at least partially covering at least one semiconductor device of the plurality of semiconductor devices.