The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Aug. 03, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10B 80/00 (2023.01); H10W 90/22 (2026.01);
U.S. Cl.
CPC ...
H10W 40/228 (2026.01); H10W 74/117 (2026.01); H10W 90/401 (2026.01); H10B 80/00 (2023.02); H10W 90/00 (2026.01); H10W 90/22 (2026.01); H10W 90/724 (2026.01);
Abstract
A semiconductor package includes a first semiconductor chip, a lower redistribution structure electrically connected to the first semiconductor chip, an upper redistribution structure on the first semiconductor chip, a conductive post electrically connecting the upper redistribution structure to the lower redistribution structure, and a first wire connecting a lower surface of the first semiconductor chip with an upper surface of the lower redistribution structure to dissipate heat of the first semiconductor chip.