The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Apr. 28, 2023
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Hyunsuk Chun, Irvine, CA (US);
Reza Sharifi, Irvine, CA (US);
Kian Yeow Gan, Irvine, CA (US);
Nicole A. Butel, Fort Collins, CO (US);
Jin Seong Choi, Irvine, CA (US);
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Abstract
The present invention is directed to semiconductor devices and integrated circuit packaging. In a specific embodiment, a semiconductor device with a heat spreader structure is provided. The heat spreader is configured to couple to a second layer to establish an effective thermal dissipation path for heat generated from a hot spot of a circuit. The second layer comprises a first portion and a second portion. The first portion is coupled to the hot spot. The heat spreader comprises a third portion and a fourth portion. The third portion comprises a protrusion coupled to the first portion via a first side surface. There are other embodiments as well.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile