The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Aug. 29, 2022
Applicant:

Daktronics, Inc., Brookings, SD (US);

Inventors:

Christopher Andrew Bower, Raleigh, NC (US);

Matthew Alexander Meitl, Durham, NC (US);

Nikhil Jain, Raleigh, NC (US);

Ronald S. Cok, Rochester, NY (US);

Assignee:

Daktronics, Inc., Brookings, SD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/70 (2026.01); H10W 72/20 (2026.01);
U.S. Cl.
CPC ...
H10P 72/74 (2026.01); H10W 72/252 (2026.01);
Abstract

A printable-component structure includes a carrier substrate, a bonding layer disposed on the carrier substrate, a solid weak-adhesion layer disposed on at least a portion of the bonding layer, at least a portion of a component disposed directly on and in contact with at least a portion of the weak-adhesion layer, and a release layer disposed in contact with at least a portion of the component. The component is adhered to the weak-adhesion layer with a force that is less than the adhesion between the component and a stamp, such as a PDMS stamp. The component can include a protruding post in sole contact with the weak-adhesion layer.


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